LF143 series adopts a new alloy system design concept, which improves the reliability of SnBi solder and can meet the needs of different low-temperature assembly application scenarios.

Applications

Laptops

Mobile terminals

LED

PV module

Thermal elements, flexible PCM

Key features

The degree of grain refinement doubles compared to that of SnBi series. 

The mechanical dropping property improves by more than 100% compared to that of SnBiAg solders.

No failures and hot tearing after undergoing 1500 cycles ranging from -40℃ to 100℃.

The interface IMC has no cracks with less than 5μm of the thickness after aging for 600h at at 120℃.

Specification